REDARC Electronics Pty Ltd
Contact: Mike HartasEIDA Members Only: Please add your business and capability statement
REDARC offers a blend of commercial off the-shelf, modified off-the-shelf and customised and build-to-print electronic solutions that improve the capability, safety and flexibility of a variety of vehicles and applications. As an Australian-owned and operated design-to-manufacture business, REDARC is uniquely positioned to support your specific requirements, both now and in the future. REDARC have supplied battery monitoring and power management solutions to OEM, aftermarket, heavy trucking and defence vehicles domestically and internationally. Having spent 25 years working with heavy vehicle original equipment manufacturers, REDARC have become world class leaders in product innovation ensuring an industry leading level of service to both manufacturers and end users alike. With over 250 years combined experience in their engineering department, a purpose-built design and manufacturing facility and a hand-picked production team, REDARC has the capability to conceptualise, design, test and manufacture products from smart relays to complex electronics. Over 30 staff are solely focused on design innovation, with 15% of revenue reinvested in Research and Development.
REDARC Electronics’ in-house engineering team can customise products to suit any specific requirements. Surface Mount Technology REDARC specialise in both Low Volume High Mix (LVHM) and Medium Volume Low Mix (MVLM) to cater for a wide and diverse client base. Located in their Clean Room is state-of-the-art Surface Mount Technology which allows the manufacture of products in large quantities at a consistently high-quality level, and an X-ray machine capable of inspecting products down to the hidden solder joints. Column Grid Array PCB assembly Column Grid Array (CGA) PCB assembly is a new capability made possible with the Vacuum Vapour Phase soldering oven (the Asscon VP7000). REDARC offer PCB assembly with a range of CGA packages that offer stronger, more reliable connections than BGA (Ball Grid Array) IC packages. The CGA package results in a greater component-to-board standoff distance, which can absorb greater Coefficient of Thermal Expansion (CTE) mismatches between the board and component during wide temperature variations in the field. These improved thermal characteristics substantially increase the thermal fatigue life of the package’s solder joints, as CTE mismatch and thermal cycling of the product is a leading cause of failed solder joints. The use of CGA packages is becoming increasingly popular as an alternative to BGA packages, where very high-density interconnections and higher board-level reliability is a requirement. Key applications for CGA technology are in industries where reliability is paramount – and failure is not an option – industries such as defence, aerospace and medical. Testing and Validation Technology In-house testing capabilities include a Highly Accelerated Life Testing and Highly Accelerated Stress Screening (HALT/HASS) which accelerates ten years of product life over two days, it cools to minus 100 and heats to 200 degrees Celsius; a Vibration and Climatic Chamber combination or AGREE machine simulates driving conditions and temperature and humidity extremes; and an Electro-Magnetic Chamber (EMC) that performs full compliance measurements of radiated emission and immunity at a three meter test distance. REDARC’s highly skilled engineering staff have previously run certified test laboratories giving them the skills and knowledge to test to international standards. Testing equipment has been specifically designed to ensure that all REDARC products meet the standards required by our most demanding customers. Every REDARC product is extensively tested before it leaves the facility.